3C Electronics
- Categories:Solution
- Author:
- Origin:
- Time of issue:2021-10-28
- Views:0
(Summary description)The shift of mobile phones from mobile terminals to smart terminals means that the functional requirements of mobile phones are increasing. The highly integrated and thinner mobile phone modules have become a trend. The new materials and high-precision requirements brought about by this trend have made laser micro-nano processing significant advantages. At the same time, with the advent of 5G, the unlimited radio frequency layer is developing towards miniaturization, light weight, and high integration. The application of high-frequency and low-loss materials in the signal transmission layer has accelerated the penetration of micro-nano laser applications.
3C Electronics
(Summary description)The shift of mobile phones from mobile terminals to smart terminals means that the functional requirements of mobile phones are increasing. The highly integrated and thinner mobile phone modules have become a trend. The new materials and high-precision requirements brought about by this trend have made laser micro-nano processing significant advantages. At the same time, with the advent of 5G, the unlimited radio frequency layer is developing towards miniaturization, light weight, and high integration. The application of high-frequency and low-loss materials in the signal transmission layer has accelerated the penetration of micro-nano laser applications.
- Categories:Solution
- Author:
- Origin:
- Time of issue:2021-10-28
- Views:0
The shift of mobile phones from mobile terminals to smart terminals means that the functional requirements of mobile phones are increasing. The highly integrated and thinner mobile phone modules have become a trend. The new materials and high-precision requirements brought about by this trend have made laser micro-nano processing significant advantages. At the same time, with the advent of 5G, the unlimited radio frequency layer is developing towards miniaturization, light weight, and high integration. The application of high-frequency and low-loss materials in the signal transmission layer has accelerated the penetration of micro-nano laser applications.
Flexible material processing
For this material, large-size, high-precision laser micro-nano processing has become inaccessible, and even the only feasible processing tool. The full laser processing technology of laser cutting, drilling, stripping, marking, annealing and removal is realized in the future. With higher requirements, micro-nano processing will continue to be optimized.
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